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Description
On 18 January 2023, Hua Hong Grace, a semiconductor manufacturer entered into a joint venture agreement with the state-backed China IC Fund II. The China Integrated Circuit Industry Investment Fund Co...
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Intervention Details
Intervention Type
Capital injection and equity stakes (including bailouts)
MAST Chapter
L: Subsidies (excl. export subsidies)
Implementation date
18 Jan 2023
Revocation date
No revocation date
Implementation level
NFI
Affected flow
Inward
Announced as temporary
No
Eligible firms
firm-specific
Affected Trading Partners
Table
Affected Sectors
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Affected Products
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Threads
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