Global Trade Alert
Global Trade Alert

United States of America: Introduction of funding to support microelectronics packaging technologies

Announcement

16 Jan 2025

In January 2025, the U.S. Department of Commerce awarded Arizona State University (ASU) USD 100 million to advance microelectronics packaging technologies.

Source

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Number of interventions

1

1 certainly harmful

0 likely harmful

0 liberalising

List of interventions

1 in force

Implementation date

16 Jan 2025

Revocation date:

No revocation date

State aid, unspecified In force

On 16 January 2025, the U.S. Department of Commerce awarded Arizona State University (ASU) USD 100 million to advance microelectronics packaging technologies using fan-out-wafer-level-processing (FOWL...

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