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Description
On 16 January 2025, the U.S. Department of Commerce awarded Arizona State University (ASU) USD 100 million to advance microelectronics packaging technologies using fan-out-wafer-level-processing (FOWL...
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Intervention Details
Intervention Type
State aid, unspecified
MAST Chapter
L: Subsidies (excl. export subsidies)
Implementation date
16 Jan 2025
Revocation date
No revocation date
Implementation level
National
Affected flow
Inward
Announced as temporary
No
Eligible firms
all
Affected Trading Partners
Table
Affected Sectors
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Affected Products
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