Announcement
18 Oct 2024
In October 2024, the U.S. Department of Commerce released a funding opportunity announcement worth approximately USD 1.6 billion to accelerate semiconductor advanced packaging technologies.
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Number of interventions
1
1 certainly harmful
0 likely harmful
0 liberalising
List of interventions
Implementation date
18 Oct 2024
Revocation date:
20 Dec 2024
Updated: 18 Oct 2024
Financial grant
On 18 October 2024, the U.S. Department of Commerce (DOC) issued a Funding Opportunity Announcement (FOA) to support the development of semiconductor advanced packaging technologies. Eligible benef...
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