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Description
On 18 October 2024, the U.S. Department of Commerce (DOC) issued a Funding Opportunity Announcement (FOA) to support the development of semiconductor advanced packaging technologies. Eligible benefici...
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Intervention Details
Intervention Type
Financial grant
MAST Chapter
L: Subsidies (excl. export subsidies)
Implementation date
18 Oct 2024
Revocation date
20 Dec 2024
Implementation level
National
Affected flow
Inward
Announced as temporary
Yes
Eligible firms
all
Affected Trading Partners
Table
Affected Sectors
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Affected Products
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