Announcement
28 Feb 2024
In February 2024, the US Department of Commerce announced a funding opportunity to support semiconductor packaging.
Source
Sign in to access
Number of interventions
1
1 certainly harmful
0 likely harmful
0 liberalising
List of interventions
Implementation date
28 Feb 2024
Revocation date:
No revocation date
Updated: 28 Feb 2024
Financial grant
In force
On 28 February 2024, the U.S. Department of Commerce (DOC) announced a notice of funding opportunity (NOFO) to solicit applications for research and development activities to expedite domestic prod...
Sign in to see more
Related State Acts
29 Sep 2023
United States of America: Department of Commerce announces a funding opportunity for the production of semiconductor materials and manufacturing equipment with capital investment up to USD 300 million
23 Jun 2023
United States of America: Department of Commerce announces a funding opportunity for the production of semiconductor materials and manufacturing equipment with capital investment of USD 300 million or above
09 Aug 2022
United States of America: U.S. Administration enacts the CHIPS and Science Act of 2022
Threads
See all
This state act is not part of any Thread yet.