Announcement
28 Feb 2024
In February 2024, the US Department of Commerce announced a funding opportunity to support semiconductor packaging.
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Number of interventions
1
1 certainly harmful
0 likely harmful
0 liberalising
List of interventions
1 in force
Implementation date
28 Feb 2024
Revocation date:
No revocation date
Financial grant
In force
On 28 February 2024, the U.S. Department of Commerce (DOC) announced a notice of funding opportunity (NOFO) to solicit applications for research and development activities to expedite domestic product...
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Related State Acts
09 Aug 2022
United States of America: U.S. Administration enacts the CHIPS and Science Act of 2022
29 Sep 2023
United States of America: Department of Commerce announces a funding opportunity for the production of semiconductor materials and manufacturing equipment with capital investment up to USD 300 million
23 Jun 2023
United States of America: Department of Commerce announces a funding opportunity for the production of semiconductor materials and manufacturing equipment with capital investment of USD 300 million or above
09 Aug 2022
United States of America: U.S. Administration enacts the CHIPS and Science Act of 2022
23 Jun 2023
United States of America: Department of Commerce announces a funding opportunity for the production of semiconductor materials and manufacturing equipment with capital investment of USD 300 million or above
29 Sep 2023
United States of America: Department of Commerce announces a funding opportunity for the production of semiconductor materials and manufacturing equipment with capital investment up to USD 300 million
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