Announcement
24 Jan 2024
In January 2024, the US Department of Defense announced funding to improve advanced semiconductor packaging capabilities.
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Number of interventions
1
1 certainly harmful
0 likely harmful
0 liberalising
List of interventions
Implementation date
24 Jan 2024
Revocation date:
No revocation date
Updated: 24 Jan 2024
State aid, unspecified
In force
On 24 January 2024, the U.S. Department of Defense (DOD) awarded Micross Components a USD 45.6 million contract to support its advanced packaging capabilities and capacity for semiconductors used i...
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