Announcement
21 Dec 2023
In December 2023, the US Department of Defense approved funding to support the production of integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), as well as advanced packaging.
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Number of interventions
1
1 certainly harmful
0 likely harmful
0 liberalising
List of interventions
Implementation date
21 Dec 2023
Revocation date:
No revocation date
Updated: 21 Dec 2023
State aid, unspecified
In force
On 21 December 2023, the U.S. Department of Defense (DOD) awarded GreenSource Fabrication LLC a USD 46.2 million contract to support the production of certain components of semiconductors and advan...
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