Announcement
27 Mar 2023
The U.S. Administration determined that printed circuit boards and advanced packaging, their components, and the manufacturing systems that produce such systems and component are eligible for certain subsidies and public procurement advantages under DPA Title III Section 303.
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Number of interventions
3
3 certainly harmful
0 likely harmful
0 liberalising
List of interventions
Implementation date
27 Mar 2023
Revocation date:
No revocation date
Updated: 27 Mar 2023
In-kind grant
In force
On 27 March 2023, the U.S. Administration activated certain incentives for printed circuit boards and advanced packaging production systems following designating the subject products under the Defe...
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Updated: 27 Mar 2023
State aid, unspecified
In force
On 27 March 2023, the U.S. Administration issued an authorization determining printed circuit boards and advanced packaging production systems as eligible to receive unspecified subsidy payments fo...
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Updated: 27 Mar 2023
Public procurement, nes
In force
On 27 March 2023, the U.S. Administration activated certain incentives for printed circuit boards and advanced packaging production systems following designating the subject products under the Defe...
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