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Japan: JBIC signs USD 97.5 billion loan agreement to promote Japanese electronic components sales and exports in Asia

Description

On 27 April 2016, the Japan Bank for International Cooperation (JBIC) signed a USD 97.5 million overseas investment loan agreement with Vietnamese SEI Electronic Components (Vietnam) Ltd. (SEEV) The ...

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Intervention Details

Intervention Type

Financial assistance in foreign market

MAST Chapter

P: Export-related measures (incl. subsidies)

Implementation date

27 Apr 2016

Revocation date

No revocation date

Implementation level

NFI

Affected flow

Outward subsidy

Announced as temporary

No

Eligible firms

firm-specific

Affected Trading Partners

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Affected Sectors

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Affected Products

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