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Global Trade Alert

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United States of America: Authorization of certain subsidies and public procurement advantages for printed circuit boards and advanced packaging production systems following the designation under DPA Title III

Description

On 27 March 2023, the U.S. Administration activated certain incentives for printed circuit boards and advanced packaging production systems following designating the subject products under the Defense...

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Intervention Details

Intervention Type

In-kind grant

MAST Chapter

L: Subsidies (excl. export subsidies)

Implementation date

27 Mar 2023

Revocation date

No revocation date

Implementation level

National

Affected flow

Inward

Announced as temporary

No

Eligible firms

all

Affected Trading Partners

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Affected Sectors

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Affected Products

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